iPhone 7 May Use New Packaging Technology for Antenna Switching Module to Save Space
Rumors have suggested the iPhone 7 will be thinner and lighter than the iPhone 6s, and a new report from Korean site ETNews shares some technical details on the methods Apple may use to save space internally and shave off precious fractions of a millimeter from the device's size.
Apple is said to be planning to use a new fan-out packaging technology for the antenna switching module and radio frequency chip in the iPhone 7, which is a feature that allows the iPhone to switch between LTE and other antennas like GSM and CDMA. Fan-out packaging technology allows for a greater number of I/O terminals while cutting down on chip size.
A mockup of what the iPhone 7 might look like
Fan Out technology is a technology that increases number of I/O (Input/Output) terminals within a package by pulling out wiring of I/O terminals to outside from a semiconductor chip (Die), which is a previous step before packaging. As area of a chip had become narrower as manufacturing processes had become finer, it was difficult to increase number of I/O terminals. Because industries do not want to increase size of a chip just for I/O terminals, they have been paying attention to Fan Out Packaging technology recently. It is most cost effective from production cost perspective if number of I/O terminals increases within a package while still decreasing size of a chip.
Using this packaging method, along with single-chip EMI shields, Apple will be able to fit more components into a single package while minimizing signal loss and also cutting down on the potential for interference in wireless communication. The radio frequency chip built into the antenna switching module is said to include two chips in one package rather than two chips built into a printed circuit board to save space.
Apple's iPhone 7 is expected to launch in the fall of 2016. Rumors about the device suggest it will look similar to the iPhone 6s, but with redesigned antenna bands and a somewhat thinner chassis. Along with the chip packaging techniques shared today, Apple is rumored to be cutting down on the size of the device through the removal of the headphone jack and the slimming of the Lightning port.
Popular Stories
Apple will launch its new iPhone 17 series in two months, and the iPhone 17 Pro models are expected to get a new design for the rear casing and the camera area. But more significant changes to the lineup are not expected until next year, when the iPhone 18 models arrive.
If you're thinking of trading in your iPhone for this year's latest, consider the following features rumored to be coming...
In select U.S. states, residents can add their driver's license or state ID to the Wallet app on the iPhone and Apple Watch, providing a convenient and contactless way to display proof of identity or age at select airports and businesses, and in select apps.
Unfortunately, this feature continues to roll out very slowly since it was announced in 2021, with only nine U.S. states, Puerto Rico,...
Apple does not plan to refresh any Macs with updated M5 chips in 2025, according to Bloomberg's Mark Gurman. Updated MacBook Air and MacBook Pro models are now planned for the first half of 2026.
Gurman previously said that Apple would debut the M5 MacBook Pro models in late 2025, but his newest report suggests that Apple is "considering" pushing them back to 2026. Apple is now said to be...
Three out of four iPhone 17 models will feature more RAM than the equivalent iPhone 16 models, according to a new leak that aligns with previous rumors.
The all-new iPhone 17 Air, the iPhone 17 Pro, and the iPhone 17 Pro Max will each be equipped with 12GB of RAM, according to Fixed Focus Digital, an account with more than two million followers on Chinese social media platform Weibo. The...
A new Apple TV is expected to be released later this year, and a handful of new features and changes have been rumored for the device.
Below, we recap what to expect from the next Apple TV, according to rumors.
Rumors
Faster Wi-Fi Support
The next Apple TV will be equipped with Apple's own combined Wi-Fi and Bluetooth chip, according to Bloomberg's Mark Gurman. He said the chip supports ...
Since the iPhone X in 2017, all of Apple's highest-end iPhone models have featured either stainless steel or titanium frames, but it has now been rumored that this design decision will be coming to an end with the iPhone 17 Pro models later this year.
In a post on Chinese social media platform Weibo today, the account Instant Digital said that the iPhone 17 Pro models will have an aluminum...
Production of foldable OLED displays for Apple's first foldable iPhone have begun ahead of its expected launch next year, Korea's ETNews reports.
The first foldable iPhone's displays are being produced by Samsung Display, who are establishing a production line dedicated to the upcoming Apple device its A3 factory in Asan, Chungcheongnam-do. The production line will make displays exclusively...
iPhone 17 Pro and iPhone 17 Pro Max models with displays made by BOE will be sold exclusively in China, according to a new report.
Last week, it emerged that Chinese display manufacturer BOE was aggressively ramping up its OLED production capacity for future iPhone models as part of a plan to recapture a major role in Apple's supply chain.
Now, tech news aggregator Jukan Choi reports...
