The chip powering the next-generation iPhone will reportedly be based on a "4nm" process, an even smaller process compared to the 5nm process used in the iPhone 12 and iPhone 13 lineups, according to a paywalled preview of an upcoming report from DigiTimes.
Last year, Apple adopted a 5nm process with the A14 Bionic chip in the latest iPad Air and the iPhone 12 lineup. With the iPhone 13, it used an enhanced iteration of the 5nm process. For the iPhone 14, the report claims Apple and its chipmaking partner TSMC are looking to adopt a "4nm" process for the A16 Bionic, the likely name for the chip powering the next-generation iPhone.
A smaller process reduces a chip's physical footprint and offers improved performance and enhanced energy efficiency. A report yesterday by The Information claimed that TSMC and Apple are facing technical challenges in producing a 3nm chip, possibly being a reason the iPhone 14 will feature a "4nm" process instead.
Separate reports from earlier in the year have suggested that Apple has booked all of TSMC's production capacity for the 3nm process, which could instead debut in the iPhone 15 and next-generation Apple silicon Mac computers in several years.
With the iPhone 13 and iPhone 13 Pro already released, we now await what Apple has in store for the iPhone 14. While we're still a little under a year away from its launch, rumors suggest that the iPhone 14 will feature one of the most significant iPhone redesigns of the past several years. Get caught up on the latest rumors about Apple's next-generation iPhone using our roundup.
Update: While the DigiTimes report said "Apple will likely adopt TSMC's 4nm process," TSMC refers to the process as "N4P" and describes it as a "third major enhancement of TSMC's 5nm family."
Apple is planning to debut a high-end secondary version of AirPods Pro 3 this year, sitting in the lineup alongside the current model, reports suggest.
Back in September 2025, supply chain analyst Ming-Chi Kuo reported that Apple is planning to introduce a successor to the AirPods Pro 3 in 2026. This would be somewhat unusual since Apple normally waits around three years to make major...
Sunday January 18, 2026 3:51 pm PST by Joe Rossignol
iOS 27 is still many months away, but there are already plenty of rumors about new features that will be included in the software update.
The first beta of iOS 27 will be released during WWDC 2026 in June, and the update should be released to all users with a compatible iPhone in September.
Bloomberg's Mark Gurman said that iOS 27 will be similar to Mac OS X Snow Leopard, in the sense...
Tuesday January 20, 2026 2:34 am PST by Tim Hardwick
Over the last few months, rumors around the iPhone 18 Pro's front-panel design have been conflicted, with some supply-chain leaks pointing to under-display Face ID, reports suggesting a top-left hole-punch camera, and debate over whether the familiar Dynamic Island will shrink, shift, or disappear entirely.
Today, Weibo-based leaker Instant Digital shared new details that appear to clarify the ...
Sunday January 18, 2026 6:50 pm PST by Joe Rossignol
MacBook Pro availability is tightening on Apple's online store, with select configurations facing up to a two-month delivery timeframe in the United States.
A few 14-inch and 16-inch MacBook Pro configurations with an M4 Pro chip are not facing any shipping delay, but estimated delivery dates for many configurations with an M4 Max chip range from February 6 to February 24 or even later. At...
Thursday January 15, 2026 10:56 am PST by Joe Rossignol
While the iPhone 18 Pro and iPhone 18 Pro Max are not expected to launch for another eight months, there are already plenty of rumors about the devices.
Below, we have recapped 12 features rumored for the iPhone 18 Pro models, as of January 2026:
The same overall design is expected, with 6.3-inch and 6.9-inch display sizes, and a "plateau" housing three rear cameras
Under-screen Face ID...
Hate to burst everyone's bubble but there is nothing on these chips that is actually 4nm in dimensions just like the current 5-6-7nm processes that every chip manufacturer is making. It's all a historical node naming convention.