According to a new report from Economic Daily News (via DigiTimes), Taiwan Semiconductor Manufacturing Company has plans to double the output capacity of its 16nm chip production from 40,000 12-inch wafers in February to 80,000 in March. The news corroborates previous reports that suggested TSMC was ready to expand its 16nm FinFET production capacity in the second quarter of 2016, solely for the iPhone 7.

iphone_7_render_mr
In a recent investors meeting, TSMC's co-CEO CC Wei said that the company's percentage share of the 14/16nm market is expected to increase from 40 percent in 2015 to over 70 percent in 2016. Apple isn't specifically referenced in the report today, but among TSMC's other purported 16nm customers -- Xilinx, MediaTek, HiSilicon, Spreadtrum and Nvidia -- it is one of the bigger names.

The upcoming ramp-up of 16nm production capacity will buoy TSMC's sales performance starting March, the report quoted market watchers as indicating. The foundry's 16nm FinFET processes consisting of 16FF (16nm FinFET), 16FF+ (16nm FinFET Plus) and 16FFC (16nm FinFET Compact) will generate more than 20% of its total wafer revenues in 2016.

Previous rumors around the iPhone 7 production have pointed to Apple picking TSMC to be the sole manufacturer of the smartphone's processor, presumably called the A10. The foundry was said to have won over Apple because of its 10nm manufacturing process, and a likely attempt at avoiding the dual-sourced A9 chip blowback Apple saw in the iPhone 6s and iPhone 6s Plus.

Tag: TSMC
Related Forum: iPhone

Top Rated Comments

journeyy Avatar
68 months ago
The rumor in this article states that the A10 will stay at 16nm like the A9. The improvement due to "3D Transistor stacking" or whatever will be very minimal.
http://wccftech.com/iphone-7-tsmc/

20% expected.
Score: 2 Votes (Like | Disagree)
chrmjenkins Avatar
68 months ago
Bit confused, so it's going to be 16nm or 10nm chip?
16nm, 10nm won't be ready for Fall devices.
Score: 2 Votes (Like | Disagree)
rp2011 Avatar
68 months ago
I'm thinking this years iPhone is just a better 6, rather than a full fledged completely new device.

We have read that the dual camera is still a year away. That the 10nm chip is still a year away. That the new oled displays are still at least a year away. That the iPhone will be the exact same dimensions minus one mm in thickness due to an improved thinner display..
Also note that new 4" iPhone will be in a old case. I would imagine they would have crafted a completely new one unless it wasn't just a kind of placeholder until the next complete iPhone iteration.

I think Apple is working to to get all those things into the iPhone but they are just not quite ready.
Score: 1 Votes (Like | Disagree)
Benjamin Frost Avatar
68 months ago
This is good news if it takes care of ChipGate.

Let's hope a TSMC chip is guaranteed in all iPhones so as to ensure better battery life.
Score: 1 Votes (Like | Disagree)
vertsix Avatar
68 months ago
http://wccftech.com/iphone-7-tsmc/

20% expected.
Oooooh. Neat stuff.

Yeah, a 20% speed jump is what I'd consider minimal. The A9 was nearly twice as fast as the A8 and at least twice as fast as the A7.

The A8 was like up to 30% faster than the A7 I believe.
[doublepost=1456938442][/doublepost]
I'm thinking this years iPhone is just a better 6, rather than a full fledged completely new device.

We have read that the dual camera is still a year away. That the 10nm chip is still a year away. That the new oled displays are still at least a year away. That the iPhone will be the exact same dimensions minus one mm in thickness due to an improved thinner display..

I think Apple is working to to get all those things into the iPhone but they are just not quite ready.
More like they can't because profit margins.
Score: 1 Votes (Like | Disagree)
chrmjenkins Avatar
68 months ago
http://wccftech.com/iphone-7-tsmc/

20% expected.
That's wccftech just repeating the assessment made from Bernstein ('http://blogs.barrons.com/asiastocks/2015/10/22/tsmc-apple-will-pioneer-info-to-build-thinner-phones-bernstein-raises-target/'). Here's the relevant bit:

Compared with the Flip Chip-PoP (Package-on-Package, or simply FC-POP) technology employed currently, InFO removes substrate from package and hence can reduce the thickness of mobile SoC from 1mm to 0.8mm or lower. The shorter distance between logic die and printed circuit board also enables faster thermal dissipation, higher maximal allowable power consumption and possibly 20% better performance (but with power penalty).

In fact, TSMC’s InFO is just one of many variants of fan-out wafer-level package (FOWLP) which has been tried by many but with limited success thus far. With a satisfactory packaging yield, we estimate InFO (or FOWLP in general) will incur just 5-10% higher cost over the flip chip package. However, low packaging yield results in high cost from die loss, which has kept the technology from mass adoption so far. Though there are still execution risks from now to 3Q16, apparently TSMC is making progress and likely can overcome the yield challenge. This is further supported by the recent announcement of Ultratech (an equipment vendor) which we believe just received a major order for TSMC’s InFO capacity build-up.
What that means is higher performance in the same thermal envelope. That means Apple would have to be willing for the SoC to consume more power, which means less battery life or a bigger battery.

Also, if the A9 was indeed of TSMC's 16FF, then the move to 16FF+ would have a few small performance benefits on its own, similar to Samsung's own 14LPP ('http://www.samsung.com/semiconductor/foundry/process-technology/14nm/') (10%).

This post ('https://www.macrumors.com/2015/11/06/tsmc-a10-production-info-wlp/') goes into InFO in more detail.

edit: one last note- they talk about removing the substrate. That would be the substrate above the die between the memory and application processor. You still need the interface between the die and board, which is a substrate. With InFO WLP, you just route all your dies on that one piece. To have no substrate would be chip-on-board, which isn't possible because board vendors can't make boards with the extremely fine pitches that logic die bumps have. That's why vendors are starting to introduce actual passive silicon wafers (interposers) into the process to get really dense routing to greater I/O to memory and other devices.
Score: 1 Votes (Like | Disagree)

Top Stories

General Music and AirPod 3 Feature

Rumor: Apple to Announce Third-Generation AirPods and HiFi Apple Music Tier on May 18

Thursday May 13, 2021 10:32 pm PDT by
A new rumor suggests that Apple will announce the third-generation AirPods and the recently rumored HiFi, or high-fidelity Apple Music tier, on Tuesday, May 18, via a press release on its website. The new rumor comes from Apple YouTuber Luke Miani who shared the alleged exclusive news with the AppleTrack website. According to the YouTuber, Apple plans to release the next-generation AirPods...
apple park drone june 2018 2

Apple Fires Newly Hired Ex-Facebook Product Manager Following Revelations of Past Misogynistic Comments

Thursday May 13, 2021 12:10 am PDT by
Apple has fired Antonio García Martínez, an ex-Facebook product manager and author of the controversial book "Chaos Monkeys," following public and internal calls for removal and investigation due to past misogynistic statements, The Verge reports. Apple hired Martínez earlier this week to join its ads team, however, comments that Martínez made in the past sparked condemnation from users...
imac m1 blue isolated 16x9 500k

M1 iMac is Up to 56% Faster Than Prior-Generation High-End 21.5-Inch iMac

Wednesday May 12, 2021 10:03 am PDT by
Apple's M1 iMacs are set to start delivering to customers next week, and ahead of the official launch day, benchmarks for the machines have been showing up on Geekbench, likely from reviewers who are testing them. It will come as no surprise that M1 iMac benchmarks are right on par with benchmarks for the M1 MacBook Pro, MacBook Air, and Mac mini, coming in with an average single-core score...
2021 mbp hdmi slot 3d

2021 MacBook Pro Leaks Confirm Returning MagSafe and Ports

Friday May 14, 2021 3:06 am PDT by
Apple's upcoming MacBook Pro models are expected to feature a number of major changes such as larger display options and powerful new Apple silicon chips. Among the more surprising updates to this year's MacBook Pro models is the return of three ports that have been missing from the machines for over five years. Expected to come in 14- and 16-inch sizes, the 2021 MacBook Pro models are...
fortnite apple logo 2

Judge in Epic vs. Apple Case Floats Potential Compromise

Wednesday May 12, 2021 3:54 pm PDT by
In the ongoing legal battle between Apple and Epic Games, the two companies are this week calling up their expert witnesses to argue their points before Judge Yvonne Gonzalez Rogers, who will make a decision in the case after a three week trial. Expert testimony is not as exciting as some of the leaked App Store documents that were highlighted last week, especially as much of what's being...
google photos

PSA: Google Photos Unlimited Storage Ends Next Month, Here's How to Export Your Pictures to iCloud

Thursday May 13, 2021 5:26 am PDT by
For as long as it's existed, Google Photos has offered free unlimited storage for uploading images at a reduced yet good enough quality for most users. From June 1, 2021, however, all photos and videos uploaded to Google accounts will count against users' cloud storage. If you've been relying on Google to back up your media library, it may be time to move that content elsewhere. This article...
AirTag in Envelope Feature 2

AirTag Used to Successfully Track a Mailed Package Across the UK

Wednesday May 12, 2021 8:44 am PDT by
An Apple customer in the United Kingdom has successfully used Apple's Find My network to track an AirTag as it was being sent by mail to a friend in a completely different city. Outlined in a blog post at Intego, Kirk McElhearn said he taped an AirTag to a piece of card, wrapped it inside a small bubble envelope, and then sent it on its way. Kirk lives in the small town of...
m1 ipad pro chip

M1 iPad Pro Over 50% Faster Than Previous Generation in Early Benchmarks

Tuesday May 11, 2021 11:56 am PDT by
Last month, Apple introduced a new iPad Pro with the same M1 chip found in the latest Macs, and early benchmark results indicate that the M1 iPad Pro is over 50% faster than the previous-generation iPad Pro. Based on five legitimate Geekbench 5 results (here's the fifth) for the fifth-generation 12.9-inch iPad Pro with the M1 chip, the device has average single-core and multi-core scores of...
prosser macbook air colors stacked

Images Reveal Colorful New MacBook Air Design

Tuesday May 11, 2021 5:06 am PDT by
Apple's next MacBook Air will feature a completely new design and come in a range of colors like the 24-inch iMac, according to leaker Jon Prosser, who has now released supposedly accurate renders of the new machines based on leaked images. In a new video uploaded to YouTube channel Front Page Tech, Prosser elaborated on his previous prediction that Apple's next-generation MacBook Air models ...
iPhone 13 Camera Backs

iPhone 13 Models Will Be Slightly Thicker and Will Have Larger Camera Bumps

Monday May 10, 2021 10:41 am PDT by
Apple's upcoming iPhone 13 models will be slightly thicker than the iPhone 12 models and will also feature larger, thicker camera bumps with lenses that protrude less, according to iPhone 13 schematics seen by MacRumors. The new iPhone 13 and 13 Pro models are expected to feature a thickness of 7.57mm, up from 7.4mm in the iPhone 12 models. That's an increase of 0.17mm, which won't be hugely ...