According to a new report from Economic Daily News (via DigiTimes), Taiwan Semiconductor Manufacturing Company has plans to double the output capacity of its 16nm chip production from 40,000 12-inch wafers in February to 80,000 in March. The news corroborates previous reports that suggested TSMC was ready to expand its 16nm FinFET production capacity in the second quarter of 2016, solely for the iPhone 7.

iphone_7_render_mr
In a recent investors meeting, TSMC's co-CEO CC Wei said that the company's percentage share of the 14/16nm market is expected to increase from 40 percent in 2015 to over 70 percent in 2016. Apple isn't specifically referenced in the report today, but among TSMC's other purported 16nm customers -- Xilinx, MediaTek, HiSilicon, Spreadtrum and Nvidia -- it is one of the bigger names.

The upcoming ramp-up of 16nm production capacity will buoy TSMC's sales performance starting March, the report quoted market watchers as indicating. The foundry's 16nm FinFET processes consisting of 16FF (16nm FinFET), 16FF+ (16nm FinFET Plus) and 16FFC (16nm FinFET Compact) will generate more than 20% of its total wafer revenues in 2016.

Previous rumors around the iPhone 7 production have pointed to Apple picking TSMC to be the sole manufacturer of the smartphone's processor, presumably called the A10. The foundry was said to have won over Apple because of its 10nm manufacturing process, and a likely attempt at avoiding the dual-sourced A9 chip blowback Apple saw in the iPhone 6s and iPhone 6s Plus.

Tag: TSMC
Related Forum: iPhone

Top Rated Comments

journeyy Avatar
84 months ago
The rumor in this article states that the A10 will stay at 16nm like the A9. The improvement due to "3D Transistor stacking" or whatever will be very minimal.
http://wccftech.com/iphone-7-tsmc/

20% expected.
Score: 2 Votes (Like | Disagree)
chrmjenkins Avatar
84 months ago
Bit confused, so it's going to be 16nm or 10nm chip?
16nm, 10nm won't be ready for Fall devices.
Score: 2 Votes (Like | Disagree)
rp2011 Avatar
84 months ago
I'm thinking this years iPhone is just a better 6, rather than a full fledged completely new device.

We have read that the dual camera is still a year away. That the 10nm chip is still a year away. That the new oled displays are still at least a year away. That the iPhone will be the exact same dimensions minus one mm in thickness due to an improved thinner display..
Also note that new 4" iPhone will be in a old case. I would imagine they would have crafted a completely new one unless it wasn't just a kind of placeholder until the next complete iPhone iteration.

I think Apple is working to to get all those things into the iPhone but they are just not quite ready.
Score: 1 Votes (Like | Disagree)
Benjamin Frost Avatar
84 months ago
This is good news if it takes care of ChipGate.

Let's hope a TSMC chip is guaranteed in all iPhones so as to ensure better battery life.
Score: 1 Votes (Like | Disagree)
vertsix Avatar
84 months ago
http://wccftech.com/iphone-7-tsmc/

20% expected.
Oooooh. Neat stuff.

Yeah, a 20% speed jump is what I'd consider minimal. The A9 was nearly twice as fast as the A8 and at least twice as fast as the A7.

The A8 was like up to 30% faster than the A7 I believe.
[doublepost=1456938442][/doublepost]
I'm thinking this years iPhone is just a better 6, rather than a full fledged completely new device.

We have read that the dual camera is still a year away. That the 10nm chip is still a year away. That the new oled displays are still at least a year away. That the iPhone will be the exact same dimensions minus one mm in thickness due to an improved thinner display..

I think Apple is working to to get all those things into the iPhone but they are just not quite ready.
More like they can't because profit margins.
Score: 1 Votes (Like | Disagree)
chrmjenkins Avatar
84 months ago
http://wccftech.com/iphone-7-tsmc/

20% expected.
That's wccftech just repeating the assessment made from Bernstein ('http://blogs.barrons.com/asiastocks/2015/10/22/tsmc-apple-will-pioneer-info-to-build-thinner-phones-bernstein-raises-target/'). Here's the relevant bit:

Compared with the Flip Chip-PoP (Package-on-Package, or simply FC-POP) technology employed currently, InFO removes substrate from package and hence can reduce the thickness of mobile SoC from 1mm to 0.8mm or lower. The shorter distance between logic die and printed circuit board also enables faster thermal dissipation, higher maximal allowable power consumption and possibly 20% better performance (but with power penalty).

In fact, TSMC’s InFO is just one of many variants of fan-out wafer-level package (FOWLP) which has been tried by many but with limited success thus far. With a satisfactory packaging yield, we estimate InFO (or FOWLP in general) will incur just 5-10% higher cost over the flip chip package. However, low packaging yield results in high cost from die loss, which has kept the technology from mass adoption so far. Though there are still execution risks from now to 3Q16, apparently TSMC is making progress and likely can overcome the yield challenge. This is further supported by the recent announcement of Ultratech (an equipment vendor) which we believe just received a major order for TSMC’s InFO capacity build-up.
What that means is higher performance in the same thermal envelope. That means Apple would have to be willing for the SoC to consume more power, which means less battery life or a bigger battery.

Also, if the A9 was indeed of TSMC's 16FF, then the move to 16FF+ would have a few small performance benefits on its own, similar to Samsung's own 14LPP ('http://www.samsung.com/semiconductor/foundry/process-technology/14nm/') (10%).

This post ('https://www.macrumors.com/2015/11/06/tsmc-a10-production-info-wlp/') goes into InFO in more detail.

edit: one last note- they talk about removing the substrate. That would be the substrate above the die between the memory and application processor. You still need the interface between the die and board, which is a substrate. With InFO WLP, you just route all your dies on that one piece. To have no substrate would be chip-on-board, which isn't possible because board vendors can't make boards with the extremely fine pitches that logic die bumps have. That's why vendors are starting to introduce actual passive silicon wafers (interposers) into the process to get really dense routing to greater I/O to memory and other devices.
Score: 1 Votes (Like | Disagree)

Popular Stories

iPhone 14 Dummies 1 Feature

Everything Rumored for Apple's September Event: iPhone 14, Apple Watch Pro and More

Friday August 12, 2022 2:34 pm PDT by
There's just about a month to go until Apple holds its annual September event focusing on new iPhone and Apple Watch models. We thought we'd take a quick look at everything that's rumored for Apple's September event to give MacRumors readers a rundown on what to expect when the first fall event rolls around. iPhone 14 The iPhone 14 can probably be described more as an "iPhone 13S" because...
z fold 4 1

Hands-On With Samsung's Latest Foldable Smartphones, the Galaxy Z Fold and Z Flip

Friday August 12, 2022 12:46 pm PDT by
Samsung this week launched its fourth-generation foldable devices, the $1,000 Galaxy Z Flip and the $1,800 Galaxy Z Fold. Though there's no sign of a comparable Apple foldable device on the horizon, rumors suggest prototypes are in the works, so we thought we'd take a look at Samsung's newest smartphones to see what Apple needs to measure up to when a foldable iPhone does come out. Subscribe ...
iPhone 14 Pro Purple Rear Flat MacRumors Exclusive

iPhone 14 Pro: Analyst Believes Storage Will Continue to Start at 128GB Despite Rumored Price Increase

Friday August 12, 2022 7:04 am PDT by
It wouldn't be the month before an iPhone launch without a few back-and-forth rumors, with the latest debate concerning iPhone 14 Pro storage. iPhone 14 Pro render by Ian Zelbo While research firm TrendForce forecasted that iPhone 14 Pro models could start with an increased 256GB of storage, Haitong International analyst Jeff Pu today forecasted that the upcoming Pro models will continue to...
iPhone 14 Pro Purple Front and Back MacRumors Exclusive feature

iPhone 14 Is Just a Few Weeks Away: Three Tips to Prepare for the New iPhone

Wednesday August 10, 2022 4:08 am PDT by
The launch of the new iPhone 14 is just a few weeks away, meaning millions of iPhone customers will soon upgrade their existing iPhone or perhaps get an iPhone for the first time. Exclusive MacRumors iPhone 14 Pro renders by graphic designer Ian Zelbo Whether upgrading from an older model or this is your first iPhone, we've rounded up a few tips to help you prepare for the next flagship...
iPhone 14 Pro Lineup Feature Silver

Kuo: Apple to Increase Prices of iPhone 14 Pro Models

Wednesday August 10, 2022 8:22 am PDT by
Apple plans to increase the prices of iPhone 14 Pro models compared to iPhone 13 Pro models, according to analyst Ming-Chi Kuo. Kuo did not reveal exact pricing for the iPhone 14 Pro models. However, in a tweet today, he estimated that the average selling price of the iPhone 14 lineup as a whole will increase by about 15% compared to the iPhone 13 lineup. In the United States, the iPhone...
top stories 13aug2022

Top Stories: New Battery Percentage Icon in iOS 16, USB-C AirPods Rumor, and More

Saturday August 13, 2022 6:00 am PDT by
This week brought some shocking news for iOS 16 beta testers, with Apple bringing back the iPhone battery percentage to the status bar after a number of years. Other news and rumors this week included word that Apple has started recording portions of its media event planned for next month to introduce the iPhone 14 and Apple Watch Series 8, claims about iPhone 14 Pro pricing and Apple's...