The M2 Pro and M2 Max MacBook Pro models feature a considerably smaller heatsink due to supply chain issues, teardowns suggest.
Top: M1 Pro logic board with larger heatsink. Bottom: M2 Pro logic board with smaller heatsink (via iFixit).
The new MacBook Pro's revised thermal architecture appears to be caused by the reduced overall footprint of the M2 Pro and M2 Max SoCs inside the device, as noted by iFixit and Max Tech. The M1 Pro and M1 Max MacBook Pro models contained two, large memory modules, but the M2 Pro and M2 Max MacBook Pro models contain four slimmer memory modules. Even though the M2 Pro and M2 Max dies are physically larger than those of the M1 Pro and M1 Max, the SoCs as a whole take up less space.
Left: M1 Pro SoC. Right: M2 Pro SoC (via iFixit).
This means that the M2 Pro and M2 Max MacBook Pro models do not require a heatsink as large as the one used for the previous generation. It is not clear if this significantly impacts thermal efficiency.
The reason for the use of four smaller memory modules appears to be supply chain issues. The entire SoC is mounted on a substrate, so four smaller modules allow Apple to use a smaller substrate, making a saving on materials and reducing complexity as a result. Dylan Patel, Chief Analyst at SemiAnalysis, told iFixit:
ABF substrates were in very short supply when Apple made the design choice. By using four smaller modules rather than two larger ones, they can decrease routing complexity within the substrate from the memory to the SoC, leading to fewer layers on the substrate. This allows them to stretch the limited substrate supply further.
The M2 Pro and M2 Max deliver up to 20 percent better CPU performance and 30 percent better GPU performance than their predecessors, but since the chips continue to be based on TSMC's 5nm process, some users have noted that Apple may have made thermal tradeoffs in order to deliver improved performance.
Sunday February 1, 2026 10:08 am PST by Joe Rossignol
Last year, Apple launched CarPlay Ultra, the long-awaited next-generation version of its CarPlay software system for vehicles. Nearly nine months later, CarPlay Ultra is still limited to Aston Martin's latest luxury vehicles, but that should change fairly soon.
In May 2025, Apple said many other vehicle brands planned to offer CarPlay Ultra, including Hyundai, Kia, and Genesis.
In his Powe...
Sunday February 1, 2026 12:31 pm PST by Joe Rossignol
The calendar has turned to February, and a new report indicates that Apple's next product launch is "imminent," in the form of new MacBook Pro models.
"All signs point to an imminent launch of next-generation MacBook Pros that retain the current form factor but deliver faster chips," Bloomberg's Mark Gurman said on Sunday. "I'm told the new models — code-named J714 and J716 — are slated...
Sunday February 1, 2026 5:42 am PST by Joe Rossignol
Apple is planning to launch new MacBook Pro models with M5 Pro and M5 Max chips alongside macOS 26.3, according to Bloomberg's Mark Gurman.
"Apple's faster MacBook Pros are planned for the macOS 26.3 release cycle," wrote Gurman, in his Power On newsletter today.
"I'm told the new models — code-named J714 and J716 — are slated for the macOS 26.3 software cycle, which runs from...
Tuesday February 3, 2026 7:47 am PST by Joe Rossignol
We are still waiting for the iOS 26.3 Release Candidate to come out, so the first iOS 26.4 beta is likely still at least a week or two away. Following beta testing, iOS 26.4 will likely be released to the general public in March or April.
Below, we have recapped known or rumored iOS 26.3 and iOS 26.4 features so far.
iOS 26.3
iPhone to Android Transfer Tool
iOS 26.3 makes it easier...
Saturday January 31, 2026 10:51 am PST by Joe Rossignol
Apple recently updated its online store with a new ordering process for Macs, including the MacBook Air, MacBook Pro, iMac, Mac mini, Mac Studio, and Mac Pro.
There used to be a handful of standard configurations available for each Mac, but now you must configure a Mac entirely from scratch on a feature-by-feature basis. In other words, ordering a new Mac now works much like ordering an...
That's not a heatsink. That's just the interface block that you are describing. The heat is transferred to the two radiator fins. The fans then blow air across the fins. The radiator fins are the heat sink. At least, that's what I classically think of as the heatsink.
This interface block completely covers the chip. It's fine.
Top: M1 Pro logic board with larger heatsink. Bottom: M2 Pro logic board with smaller heatsink (via iFixit).
Left: M1 Pro SoC. Right: M2 Pro SoC (via iFixit).
