Phone Chip Expert

Apple will begin using a new material to make its printed circuit boards thinner starting next year, according to a source with a good track record. Apple will reportedly switch to using resin coated copper (RCC) foil as a new printed circuit board (PCB) material in 2024. The change will apparently allow Apple to make its PCBs even thinner. Current iPhone PCBs are made from a flexible copper ...

The A17 chip designed for the iPhone 16 and ‌iPhone 16‌ Plus will be made using a fundamentally different manufacturing process to the A17 Pro in the iPhone 15 Pro to cut costs, according to a rumor that has now been clarified by a reliable source. A Weibo user who claims to be an integrated circuit expert with 25 years of experience working on Intel's Pentium processors was first to float...

The A17 Bionic chip initially used in the iPhone 15 Pro and ‌iPhone 15 Pro‌ Max later this year will fundamentally differ from a version of the same chip set to be manufactured in 2024, a new rumor claims. The A17 Bionic is expected to be Apple's first chip manufactured with a 3nm fabrication process, resulting in major performance and efficiency improvements over the 5nm technique used for...

The iPhone 15 and iPhone 15 Pro's USB-C port and accompanying charging cables will feature a Lightning-like authenticator chip, potentially limiting their functionality with Apple-unapproved accessories, a rumor shared on Weibo suggests. The rumor declares that Apple has developed its own variant of USB-C for this year's ‌iPhone 15‌ lineup and comes from a user who claims to be an...

The iPhone 6s and iPhone 6s Plus was just released in first-wave launch countries around the world last Friday, but a few new rumors about the 2016 "iPhone 7" have begun to surface online this morning. According to a source from the Chinese social media site Weibo (via Mac Otakara) [Google Translate], the next version of the iPhone will have a strengthened, waterproof frame and may ditch a...