Intel's 8th-Gen Xeon and Core Processors Feature Redesigned Hardware to Address Spectre and Meltdown Vulnerabilities
Intel CEO Brian Krzanich today announced that its next-generation Xeon Scalable (Cascade Lake) processors and its 8th-generation Intel Core processors will feature redesigned components to protect against the Spectre and Meltdown vulnerabilities that affect all modern processors.
Spectre variant 1 of the vulnerabilities will continue to be addressed in software, while Intel is implementing hardware-based design changes to offer future protection against Spectre variant 2 and Meltdown variant 3.

We have redesigned parts of the processor to introduce new levels of protection through partitioning that will protect against both Variants 2 and 3. Think of this partitioning as additional "protective walls" between applications and user privilege levels to create an obstacle for bad actors.
Intel's new Xeon Scalable processors and its 8th-generation Intel Core processors are expected to start shipping out to manufacturers in the second half of 2018.
Ahead of the hardware changes, Intel says that software-based microcode updates have now been issued for 100 percent of Intel products launched in the past five years, and all customers should make sure to continue to keep their systems up-to-date with software updates.
Krzanich also reaffirmed
Intel's commitment to customer-first urgency, transparent and timely communications, and ongoing security reassurance.
Apple began addressing the Meltdown and Spectre vulnerabilities back in early January with the release of iOS 11.2, macOS 10.13.2, and tvOS 11.2, which introduced mitigations for Meltdown. Subsequent iOS 11.2.2 and macOS High Sierra 10.13.2 Supplemental updates introduced mitigations for Spectre, as did patches for both macOS Sierra and OS X El Capitan in older machines.
Apple's software mitigations for the vulnerabilities have not resulted in any significant measurable decline in performance.
Popular Stories
In addition to updating many of its existing products, Apple is expected to unveil five all-new products this year, including a smart home hub, a Face ID doorbell, a MacBook with an A18 Pro chip, a foldable iPhone, and augmented reality glasses.
Below, we have recapped rumored features for each product.
Smart Home Hub
Apple home hub (concept)
Apple's long-rumored smart home hub should...
Apple is planning to debut a high-end secondary version of AirPods Pro 3 this year, sitting in the lineup alongside the current model, reports suggest.
Back in September 2025, supply chain analyst Ming-Chi Kuo reported that Apple is planning to introduce a successor to the AirPods Pro 3 in 2026. This would be somewhat unusual since Apple normally waits around three years to make major...
Apple is working on a small, wearable AI pin equipped with multiple cameras, a speaker, and microphones, reports The Information. If it actually launches, the AI pin will likely run the new Siri chatbot that Apple plans to unveil in iOS 27.
The pin is said to be similar in size to an AirTag, with a thin, flat, circular disc shape. It has an aluminum and glass shell, and two cameras at the...
Over the last few months, rumors around the iPhone 18 Pro's front-panel design have been conflicted, with some supply-chain leaks pointing to under-display Face ID, reports suggesting a top-left hole-punch camera, and debate over whether the familiar Dynamic Island will shrink, shift, or disappear entirely.
Today, Weibo-based leaker Instant Digital shared new details that appear to clarify the ...
Apple is expected to release MacBook Pro models with M5 Pro and M5 Max chips soon, but you might want to pass on them, as bigger changes are around the corner.
It has been reported that the MacBook Pro will be receiving a major redesign in late 2026 or in 2027. Six new features have been rumored so far, including an OLED display, touch capabilities, a Dynamic Island, M6 Pro and M6 Max chips...