IBM and 45nm Chip Development
IBM and Toppan Printing Co Ltd announced a $200 million deal to jointly develop a 45-nanometer chip making process aimed at production by mid-2007.
Specifically, the companies hope to develop a photomask process, which would be used to etch patterns of integrated circuits onto silicon wafers, to enable early production of advanced 45nm semiconductors.
IBM's PowerPC 970 was initially produced at a 130-nm manufacturing process while 90nm based PowerMacs were introduced in June 2004. Poor 90nm production yields has been cited for delays in PowerPC shipments and development.
Smaller manufacturing processes typically increase clock-speeds and decrease costs for the processors.
Popular Stories
In his Power On newsletter today, Bloomberg's Mark Gurman reiterated that iOS 27 will be similar to 2009's Mac OS X Snow Leopard, in the sense that one of Apple's biggest priorities is bug fixes for improved performance and stability.
During WWDC 2008's State of the Union, Apple showed a slide that said Mac OS X Snow Leopard had "0 new features," as it opted to focus on performance and...
Apple today unveiled AirPods Max 2, with key upgrades including the H2 chip, increased active noise cancellation, improved sound quality, and features such as Adaptive Audio, Conversation Awareness, Voice Isolation, and Live Translation.
The new AirPods Max have the same overall design as the previous generation, with most of the new features coming from the upgrade to the H2 chip:- Adaptive ...
Surprise! Apple today unveiled the AirPods Max 2, despite no rumors suggesting that a new version of Apple's over-ear headphones were imminent.
Key upgrades compared to the previous AirPods Max include Apple's H2 chip, increased active noise cancellation, improved sound quality, and features such as Adaptive Audio, Conversation Awareness, Voice Isolation, and Live Translation.
AirPods Max ...
