Chris Jenkins

Chris is a Contributing Writer at MacRumors. An electrical engineer by trade, he likes to spend his free time with family and a hockey game or two.



Rumored A10 Production Win for TSMC Could Be Tied to Device Packaging Advances

According to a recent report from Taiwan's Commercial Times, via EE Times and a separate research report from KGI Securities' Ming-Chi Kuo, Taiwan-based TSMC may have won sole production rights on the A10 chip slated for the next-generation iPhone 7. This is in contrast to the split production of the A9 processor between Samsung and TSMC featured in the iPhone 6s and iPhone 6s Plus. Apple's decision to revert back to TSMC as a single supplier, as was seen in A8 chip production, could be motivated by advanced device packaging techniques offered by TSMC that may not have equivalents in Samsung's packaging offerings. The Commercial Times report mentions TSMC's integrated fan-out wafer-level packaging (InFO WLP) technology as one of the key inclusions in the production contract. InFO WLP is one of many competing 3D IC technologies that promise higher levels of component integration in a single package with better electrical characteristics. Among those improvements is the possibility for higher-width memory buses that support lower-power operation necessary for mobile devices, which for consumers means better performance and efficiency. 3D IC technologies are just beginning to emerge in the consumer space, with AMD's use of High Bandwidth Memory (HBM) in its Fiji XT line of discrete graphics cards being one of the first implementations. According to a paper abstract from TSMC engineers, InFO WLP also allows for better thermal performance as well as superior performance for radio frequency (RF) components such as cellular modems. We reported last year about Apple