The new Broadcom chip is described as "a new single-chip HSPA (high-speed packet access) processor that integrates all of the key 3G (third generation) cellular and mobile technologies on an extremely low power, single 65 nanometer CMOS die. "
The press release claims that it will allow manufacturers to build 3G phones with sleek form factors and a very long battery life.
Apple's Steve Jobs has been vocal that high power consumption has been the main hurdle towards adopting 3G technologies into the iPhone. Apple is expected to release a 3G iPhone in the future. Whether or not this chip plays a role remains to be seen.