eWeek reports that IBM is making a push for 65-nm Chip Development.
According to eWeek, IBM has entered into an agreement with Infineon Technologies AG and Chartered Semiconductor Manufacturing in efforts to reach 65-nm and later, 45-nm chips on 300-mm silicon wafers (pictured here).
Almost 200 engineers will be conducting the work in IBM's Advanced Semiconductor Technology Center in Fishkill, NY.
IBM's PowerPC 970 (G5) is produced utilizing a 130-nm manufacturing process. 90nm process chips are expected from IBM at their new Fishkill plant. This size reduction is referred to as a "die shrink" and allows faster speeds, less heat, and increased manufacturing capacity. Unconfirmed rumors previously pegged 65nm process chips to arrive in 2005/2006 -- but this is of unknown reliability.
