A10


'A10' Articles

iPhone 7 Chip Manufacturer Counts Cost of Earthquake Damage

The sole company responsible for manufacturing the processor in Apple's upcoming iPhone 7 and iPhone 7 Plus has reduced its shipping estimates after its facilities were damaged in an earthquake (via DigiTimes). Taiwan Semiconductor Manufacturing Company (TSMC) suffered the damage to its plants on February 6 when a 6.4-magnitude quake struck the southern part of the country. Initially, TSMC reported that the damage incurred would reduce the amount of chips it could ship by less than 1 percent. However, this morning the company revised that estimate and said shipment numbers could be affected over the 1 percent mark, but stopped short of giving a specific number. Mockup of iPhone 7 case showing flush rear camera and no antenna bands across rear Despite the earthquake, TSMC stated it is confident of hitting target revenues of $5.9-6.0 billion in the first quarter of 2016. Whether the damage will affect production of the iPhone 7 chip, which is expected to begin in June, remains unclear. TSMC reached a deal with Apple only last week to become the sole manufacturer for the iPhone 7's processor, partly thanks to its 10-nanometer manufacturing process. Apple used both Samsung and TSMC to manufacture the chips for the iPhone 6s, perhaps in a bid to lower risks, but the arrangement caused some controversy after benchmarks indicated performance variances between the companies' processors. The processor in the iPhone 7 and iPhone 7 Plus is likely called the A10. Both devices are expected to debut in September. Leaks of the phones' design suggest that it may have a

iPhone 7 Processor to Be Manufactured Solely by TSMC [Updated]

Taiwan Semiconductor Manufacturing Company (TSMC) has reached a deal with Apple to be the only manufacturer for the iPhone 7's processor, likely called the A10, reports The Electronic Times [Google Translate]. TSMC won over Apple largely because of its 10-nanometer manufacturing process. The chip will reportedly go into full production in June. While TSMC's 10-nanometer process is one reason the company was awarded with a deal over rival Samsung, another likely has to do with the company's more advanced device packaging techniques, which allow for better power performance and efficiency. However, at its conference call last month, TSMC said that it was hoping to ramp up 10nm production in 2017, with a slow start to production coming in the second half of 2016. Mockup of iPhone 7 case showing flush rear camera and no antenna bands across rear Apple used both Samsung and TSMC to manufacture the chips for the iPhone 6s, which caused some controversy as early benchmarks indicated that TSMC's A9 chip outperformed Samsung's in battery life. Apple revealed that, according to its internal testing, the variance in performance was only 2 to 3 percent. The iPhone 7 and 7 Plus are expected to debut in September, and new details about the devices have been steadily dripping out. Last week, MacRumors shared some details on the phone's design, including that it would have a flush rear camera and a lack of antenna bands on its back. Other rumors indicate that the 7 Plus may feature a dual-lens camera system and that it may be waterproof and not have a headphone jack. Update: