eWeek reports that IBM is making a push for 65-nm Chip Development.
According to eWeek, IBM has entered into an agreement with Infineon Technologies AG and Chartered Semiconductor Manufacturing in efforts to reach 65-nm and later, 45-nm chips on 300-mm silicon wafers (pictured here).
Almost 200 engineers will be conducting the work in IBM's Advanced Semiconductor Technology Center in Fishkill, NY.
IBM's PowerPC 970 (G5) is produced utilizing a 130-nm manufacturing process. 90nm process chips are expected from IBM at their new Fishkill plant. This size reduction is referred to as a "die shrink" and allows faster speeds, less heat, and increased manufacturing capacity. Unconfirmed rumors previously pegged 65nm process chips to arrive in 2005/2006 -- but this is of unknown reliability.
Apple is set to unveil iOS 27 during its WWDC 2026 keynote on Monday, June 8, and the update will reportedly include two new Apple Wallet features.
First, iOS 27 will reportedly let users create their own digital passes by scanning items like movie tickets, concert passes, and gym membership cards. Many apps already offer Apple Wallet passes, but now users will be able to create a custom...
New models of the Apple TV 4K and HomePod mini are "nearly ready to go," according to the latest word from Bloomberg's Mark Gurman.
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Both devices have been ready "for months," but Apple is holding off on launching them until the more personalized version of Siri is available, he said.
"I am told the hardware for the next Apple TV...
Apple is expected to launch its first foldable iPhone later this year. Rumors suggest the "iPhone Ultra" will come in two color options, and a leaker shared an image today that allegedly shows one of them.
Posted on Weibo by the Chinese leaker known as Ice Universe, the image purportedly offers a first glimpse of Apple's foldable in white. The device is believed to have entered early mass...
