According to the paper (page 15), the new 90nm PowerPC 970 contains 58 million transitors, uses a 90-nanometer, silicon-on-insulator (SOI) process [not SSOI] and has a die size of 66 square millimeters. The 130-nm 970 PowerPC currently used in the PowerMac G5s have a die size of 121 square millimeters.
More information of the 90nm PowerPCs should be presented by IBM in February. The new PowerPCs would logically be used in upcoming PowerMac revisions.
Apple once developed "M2 Extreme" and "M3 Extreme" chips for the Mac Pro, but it decided not to release them, according to Bloomberg's Mark Gurman. He first reported on this topic in 2022, and he touched on it again in his Power On newsletter today.
"Extreme" chips would have had twice as many CPU and GPU cores as Apple's "Ultra" chips.
"The idea was to offer twice as many graphics and...
Apple developed two Mac Pro models in recent years that never made it to market, according to Bloomberg's Mark Gurman.
In his latest "Power On" newsletter, Gurman revealed that Apple internally developed two unreleased Mac Pro projects codenamed J170 and J190 before ultimately discontinuing the machine altogether.
As for new Mac Pro hardware, there were two additional models developed by...
Apple's first high-end MacBook redesign in five years is expected to arrive in the near future, bringing a run of firsts to the Mac.
Bloomberg's Mark Gurman expects the laptop to arrive between late 2026 and early 2027, with the later window now looking more likely owing to the global memory chip shortage. Analyst Ming-Chi Kuo expects mass production to begin by late 2026.
Apple last...
Apple's first foldable iPhone, with a book-style design featuring a ~5.5-inch outer display and a ~7.8-inch inner display with a minimal crease down the middle.
